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BGS16MN14 sp6t diversity antenna switch with mipi rffe interface data sheet revision 3.0 - july 4, 2014 power management & multimarket
edition july 4, 2014 published by in?neon technologies ag 81726 munich, germany c 2014 in?neon technologies ag all rights reserved. legal disclaimer the information given in this application note is given as a hint for the implementation of the infineon technologies component only and shall not be regarded as any descrip- tion or warranty of a certain functionality, condition or quality of the infineon tech- nologies component. the recipient of this application note must verify any function de- scribed herein in the real application. infineon technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non- infringement of intellectual property rights of any third party) with respect to any and all information given in this application note. information for further information on technology, delivery terms and conditions and prices, please contact the nearest in?neon technologies of?ce ( www.in?neon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest in?neon technologies of?ce. in?neon technologies components may be used in life-support devices or systems only with the express written approval of in?neon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGS16MN14 con?dential revision history document no.: BGS16MN14_v3.0.pdf revision history: revision 3.0 previous version: revision 0.8 page subjects (major changes since last revision) 15 figure 9 updated trademarks of in?neon technologies ag aurix tm , c166 tm , canpak tm , cipos tm , cipurse tm ,coolgan tm ,coolmos tm , coolset tm , coolsic tm , corecontrol tm , dave tm , di-pol tm ,easypim tm , econobridge tm , econodual tm , econopack tm , econopim tm , eicedriver tm , eupec tm , fcos tm , hitfet tm , hybridpack tm , isoface tm , i 2 rf tm , isopack tm , mipaq tm , modstack tm , my-d tm , novalithic tm , omnitune tm , optimos tm , origa tm , optiga tm , profet tm , pro-sil tm , primarion tm , primepack tm , rasic tm , reversave tm , satric tm , sieget tm , sipmos tm , solid flash tm , smartlewis tm , tempfet tm , thinq! tm , tricore tm , trenchstop tm . other trademarks advance design system tm (ads) of agilent technologies, amba tm , arm tm , multi-ice tm , primecell tm , realview tm , thumb tm of arm limited, uk. autosar tm is licensed by autosar development partnership. bluetooth tm of bluetooth sig inc. cat-iq tm of dect forum. colossus tm , firstgps tm of trimble navigation ltd. emv tm of emvco, llc (visa holdings inc.). epcos tm of epcos ag. flexgo tm of microsoft corporation. flexray tm is licensed by flexray consortium. hyperterminal tm of hilgraeve incorporated. iec tm of commission electrotechnique internationale. irda tm of infrared data association corporation. iso tm of international organization for standardization. matlab tm of mathworks, inc. maxim tm of maxim integrated products, inc. microtec tm , nucleus tm of mentor graphics corporation. mifare tm of nxp. mipi tm of mipi alliance, inc. mips tm of mips technologies, inc., usa. murata tm of murata manufacturing co., microwave office tm (mwo) of applied wave research inc., omnivision tm of omnivision technologies, inc. openwave tm openwave systems inc. red hat tm red hat, inc. rfmd tm rf micro devices, inc. sirius tm of sirius sattelite radio inc. solaris tm of sun microsystems, inc. spansion tm of spansion llc ltd. symbian tm of symbian software limited. taiyo yuden tm of taiyo yuden co. teaklite tm of ceva, inc. tektronix tm of tektronix inc. toko tm of toko kabushiki kaisha ta. unix tm of x/open company limited. verilog tm , palladium tm of cadence design systems, inc. vlynq tm of texas instruments incorporated. vxworks tm , wind river tm of wind river systems, inc. zetex tm of diodes zetex limited. last trademarks update 2012-12-13 data sheet 3 revision 3.0 - july 4, 2014
BGS16MN14 con?dential contents contents 1 features 5 2 product description 5 3 maximum ratings 6 4 operation ranges 7 5 rf characteristics 8 6 mipi rffe speci?cation 10 7 pin de?nition and package outline 14 list of figures 1 BGS16MN14 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 mipi to rf time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 received clock signal constraints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 bus active data receiver timing requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5 bus park cycle timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 bus active data transmission timing speci?cation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 7 requirements for vio-initiated reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 pin con?guration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 10 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 11 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 12 land pattern and stencil mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 13 tape dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 list of tables 1 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 maximum ratings, table i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 maximum ratings, table ii . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 operation ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 rf input power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 rf characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 imd2 testcases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 imd3 testcases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 switching time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 mipi rffe operating timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13 pin con?guration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 data sheet 4 revision 3.0 - july 4, 2014
BGS16MN14 con?dential sp6t diversity antenna switch 1 features suitable for multi-mode wcdma / lte diversity applications ultra-low insertion loss and harmonics generation 6 high-linearity, interchangeable rx ports 0.1 to 2.7 ghz coverage high port-to-port-isolation direct to battery supply enabled by large supply voltage range from 2.5 v to 5.5 v integrated mipi rffe interface supporting 1.2 and 1.8 v bus voltage software programmable mipi rffe usid no decoupling capacitors required if no dc applied on rf lines small form factor 2.0 mm x 2.0 mm 1 kv hbm esd protection rohs and weee compliant package 2 product description the BGS16MN14 is a single pole six throw (sp6t) diversity switch module optimized for wireless applications up to 2.7 ghz. it is a perfect solution for multi-mode handsets based on edge, wcdma and lte. the switch module con?guration is shown in fig. 1 . the module comes in a miniature tsnp package and comprises of a high power cmos sp6t switch with integrated mipi rffe interface. no external dc blocking capacitors are required in typical applications as long as no dc is applied to any rf port. table 1: ordering information type package marking BGS16MN14 pg-tsnp-14-3 16m2 data sheet 5 revision 3.0 - july 4, 2014
BGS16MN14 con?dential figure 1: BGS16MN14 block diagram 3 maximum ratings table 2: maximum ratings, table i at t a = 25 c, unless otherwise speci?ed parameter symbol values unit note / test condition min. typ. max. frequency range f 0.1 C C ghz 1) supply voltage v dd -0.5 C 6.0 v C storage temperature range t stg -55 C 150 c C junction temperature t j C C 125 c C rf input power at all rx ports p rf _ rx C C 32 dbm cw esd capability, cdm 2) v esd cdm 500 C +500 v all pins esd capability, hbm 3) v esd hbm -1 C +1 kv digital, digital versus rf -1 C +1 v rf esd capability, system level 4) v esd ant 8 C +8 kv ant versus system gnd, with 27 nh shunt inductor 1) switch has no highpass response. there is also a dc connection between switched paths. the dc voltage at rf ports v rfdc has to be 0v. 2) field-induced charged-device model jesd22-c101. simulates charging/discharging events that occur in production equipment and processes. potential for cdm esd events occurs whenever there is metal-to-metal contact in manufacturing. 3) human body model ansi/esda/jedec js-001-2012 ( r = 1.5 k
, c = 100 pf). 4) iec 61000-4-2 ( r = 330
, c = 150 pf), contact discharge. data sheet 6 revision 3.0 - july 4, 2014 m i p i r f f e c o n t r o l l e r s d a t a s c l k v d d g n d v i o a n t r x 0 1 r x 0 2 r x 0 3 r x 0 4 r x 0 5 s p 6 t r x 0 6
BGS16MN14 con?dential table 3: maximum ratings, table ii at t a = 25 c, unless otherwise speci?ed parameter symbol values unit note / test condition min. typ. max. thermal resistance junction - solder- ing point r thjs C 60 C k/w C maximum dc-voltage on rf ports and rf ground v rfdc 0 C 0 v no dc voltages allowed on rf ports rffe supply voltage v io -0.5 C 3.6 v C rffe control voltage levels v sclk , v sdata -0.7 C v io +0.7 v C 4 operation ranges table 4: operation ranges parameter symbol values unit note / test condition min. typ. max. supply voltage v dd 2.5 3.5 5.5 v C supply current 2) i dd C 80 200 a C supply current in user low power mode 2) i lp - 0.6 10 a C supply current in shutdown state 2) i sd - 0.5 1 a C rffe supply voltage v io 1.1 1.8 1.95 v C rffe input high voltage 1) v ih 0.7* v io C v io v C rffe input low voltage 1) v il 0 C 0.3* v io v C rffe output high voltage 1) v oh 0.8* v io C v io v C rffe output low voltage 1) v ol 0 C 0.2* v io v C rffe control input capaci- tance c ctrl C C 2 pf C rffe supply current 2) i vio C 15 C a idle state ambient temperature t a -30 25 85 c C 1) sclk and sdata 2) t a = -30 c...+85 c, v dd = 2.5...5.5 v table 5: rf input power parameter symbol values unit note / test condition min. typ. max. rx ports (50
) p rf _ rx C C 27 dbm C data sheet 7 revision 3.0 - july 4, 2014
BGS16MN14 con?dential 5 rf characteristics table 6: rf characteristics at t a = 25 c, p in = 0 dbm , v dd = 2.5...5.5 v , z 0 =50
, unless otherwise speci?ed parameter symbol values unit note / test condition min. typ. max. insertion loss rx01-06 il 0.20 0.30 0.40 db 0.1 to 1.0 ghz 0.25 0.40 0.50 db 1.0 to 2.0 ghz 0.30 0.45 0.55 db 2.0 to 2.7 ghz return loss 1) rx01-06 rl C 40 C db 0.1 to 1.0 ghz C 35 C db 1.0 to 2.0 ghz C 25 C db 2.0 to 2.7 ghz isolation (ant-rx) rx01-06 iso C 44 C db 0.1 to 1.0 ghz C 34 C db 1.0 to 2.0 ghz C 33 C db 2.0 to 2.7 ghz intermodulation distortion (umts band 1, band 5) 2nd order intermodulation imd2 low C -105 -95 dbm imt, us cell (see tab. 7 ) 3rd order intermodulation imd3 C -105 -100 dbm imt, us cell (see tab. 8 ) 2nd order intermodulation imd2 high C -110 -100 dbm imt, us cell (see tab. 7 ) harmonic generation (umts band 1, band 5) h2 p harm 75 85 C dbc 25 dbm, 50
, cw mode h3 p harm 90 95 C dbc 25 dbm, 50
, cw mode 1) on application board with application circuit according to fig. 8 data sheet 8 revision 3.0 - july 4, 2014
BGS16MN14 con?dential table 7: imd2 testcases band cw tone 1 (mhz) cw tone 1 (dbm) cw tone 2 (mhz) cw tone 2 (dbm) imt 1950 20 190 (imd2 low) -15 4090 (imd2 high) us cell 835 20 45 (imd2 low) -15 1715 (imd2 high) table 8: imd3 testcases band cw tone 1 (mhz) cw tone 1 (dbm) cw tone 2 (mhz) cw tone 2 (dbm) imt 1950 20 1760 -15 us cell 835 20 790 -15 table 9: switching time at t a = -30 c...+85 c, p in = 0 dbm , supply voltage = 2.5 v...2.5 v, unless otherwise speci?ed parameter symbol values unit note / test condition min. typ. max. switching time mipi to rf time t int 0.5 2 5 s 50 % last sclk falling edge to 90 % on, see fig. 2 power up settling time t pup C 10 25 s after power down mode figure 2: mipi to rf time data sheet 9 revision 3.0 - july 4, 2014 90% sclk rf signal sd a t a t int
BGS16MN14 con?dential 6 mipi rffe speci?cation supported mipi functions the mipi rffe interface supports following functions: register write command sequence register read command sequence register 0 write command sequence programmable usid trigger function all sequences are implemented according to the mipi alliance speci?cation for rf front-end control interface document version 1.10 - 26. july 2011. by default the device goes into low power mode after power on. table 10: register mapping register address register name data bits function default broadcast support trigger support r/w 0x0000 register_0 7:0 mode_ctrl 00000000 no yes r/w 0x001c pm_trig 7:6 pwr_mode 10 yes no r/w 5 trigger_mask_2 0 no no 4 trigger_mask_1 0 no no 3 trigger_mask_0 0 no no 2 trigger_2 0 yes no 1 trigger_1 0 yes no 0 trigger_0 0 yes no 0x001d product_id 7:0 product_id 10001001 no no r 0x001e manufacturer_id 7:0 manufacturer_id [7:0] 00011010 no no r 0x001f man_usid 7:6 spare 00 no no r/w 5:4 manufacturer_id [9:8] 01 3:0 usid 1010 0x001b group_sid 7:4 reserved 0 no no r/w 3:0 group_sid 0 data sheet 10 revision 3.0 - july 4, 2014
BGS16MN14 con?dential table 11: mipi rffe operating timing parameter symbol values unit note / test condition min. typ. max. sclk frequency fsclk 0.032 C 26 mhz full speed 0.032 C 13 mhz half speed sclk period tsclk 0.038 C 32 s full speed 0.077 C 32 s half speed sclk low period tsclkil 11.25 C C ns full speed, see fig. 3 24 C C ns half speed, see fig. 3 sclk high period tsclkih 11.25 C C ns full speed, see fig. 3 24 C C ns half speed, see fig. 3 sdata setup time ts 1 C C ns full speed, see fig. 4 2 C C ns half speed, see fig. 4 sdata hold time th 5 C C ns full speed, see fig. 4 5 C C ns half speed, see fig. 4 sdata release time tsdataz C C 10 ns full speed, see fig. 5 C C 18 ns half speed, see fig. 5 time for data output td C C 10.25 ns full speed, see fig. 6 C C 22 ns half speed, see fig. 6 sdata rise/fall time tsdataotr 2.1 C 6.5 ns full speed, see fig. 6 2.1 C 10 ns half speed, see fig. 6 vio rise time tvio-r 10 C 450 s see fig. 7 vio reset time tvio-rst 10 C C s see fig. 7 reset delay time tsigol 0.12 C C s see fig. 7 figure 3: received clock signal constraints data sheet 11 revision 3.0 - july 4, 2014 v tpma x v tnmin t sclkih t sclkil
BGS16MN14 con?dential figure 4: bus active data receiver timing requirements figure 5: bus park cycle timing data sheet 12 revision 3.0 - july 4, 2014 v tpma x v tpmin v tpma x v tpmin t s t h t h sclk sd a t a t s t sd a t az sclk sd a t a v ohmin v olma x bus p ark cy cle signal driv en signal not driv en, pull do wn only t is measur ed fr om sclk v le v el f or a de vice r eceiving sclk and driving sd a t a lines sd a t az tn v tpma x v tnmin
BGS16MN14 con?dential figure 6: bus active data transmission timing speci?cation figure 7: requirements for vio-initiated reset table 12: modes of operation (truth table) register_0 bits state mode d7 d6 d5 d4 d3 d2 d1 d0 1 isolation x 0 0 0 0 0 0 0 2 rx01 x 0 0 0 0 0 1 0 3 rx02 x 0 0 0 0 0 0 1 4 rx03 x 0 0 0 0 0 1 1 5 rx04 x 0 0 0 0 1 1 1 6 rx05 x 0 0 0 0 1 0 1 7 rx06 x 0 0 0 0 1 1 0 data sheet 13 revision 3.0 - july 4, 2014 v ohmin v olma x v tpma x v tpmin t d sclk sd a t a t sd a t a o tr t sd a t a o tr t d t sigol time vio (v) vio ma x vio min v vio-r s t (0.2v) not t o sc ale sclk & sd a t a mus t be held a t lo w le v el fr om deassertion of vio un til the end of t sigol all sla v e r egis t er s se t/r ese t t o manuf actur er ? s de f aults t vio-r s t t vio-r
BGS16MN14 con?dential 7 pin de?nition and package outline table 13: pin con?guration no. name pin type buffer type function 0 gnd gnd rf ground; die pad 1 rx03 i/o rx port 3 2 rx02 i/o rx port 2 3 rx01 i/o rx port 1 4 vdd pwr v dd supply 5 vio pwr mipi rffe supply 6 sdata i/o mipi rffe data 7 sclk i mipi rffe clock 8 nc not connected 9 rx06 i/o rx port 6 10 rx05 i/o rx port 5 11 rx04 i/o rx port 4 12 nc not connected 13 ant i/o antenna port 14 nc not connected figure 8: application circuit data sheet 14 revision 3.0 - july 4, 2014 2 7 n h a n t b g s 1 6 m n 1 4 s p 6 t
BGS16MN14 con?dential figure 9: pin con?guration (top view) figure 10: package outline figure 11: marking data sheet 15 revision 3.0 - july 4, 2014 0.05 max. 2 3 4 5 6 7 8 9 10 11 12 13 14 1 top view bottom view pin 1 marking 0.77 max. b 2 0.05 a 2 0.05 1.7 0.4 0.5 3 x 0.5 = 1.5 2 x 0.4 = 0.8 0.05 0.2 14x 0.1 b 0.1 b 0.45 0.45 0.2 x 45 14x 0.05 0.17 0.05 1.1 0.05 1.1 0.1 a 0.1 a pin 1 marking type code date code (yyww) 1234
BGS16MN14 con?dential figure 12: land pattern and stencil mask figure 13: tape dimensions data sheet 16 revision 3.0 - july 4, 2014 0.4 0.5 0.4 0.85 0.4 0.4 0.85 0.85 0.25 0.5 0.85 0.25 14x 0.22 0.22 14x 0.25 0.25 1.1 1.1 1.1 stencil apertures copper solder mask (stencil thickness 80 m) 4 0.95 pin 1 marking 2.3 2.3 8
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